EN
0
Home > Products > Coating & Ink Chemicals > Coating Raw Materials > YXMMTUJDQTVJEN-PHDIDXHHSA-N
YXMMTUJDQTVJEN-PHDIDXHHSA-N structure, CAS 107998-45-8

YXMMTUJDQTVJEN-PHDIDXHHSA-N

CAS Number107998-45-8

Synonyms

Molecular FormulaC7H15NO2

Molecular Weight145.20

Purity

Density

Boiling Point

Melting Point

Flash Point

Appearance

EINECS

MSDSChineseEnglish

Symbol

Signal Word

Cat. No.: 2A-4201006 Purity:
Change View

Please Login or Create an Account to: See VlP prices and availability

US Stock: ship in 0-1 business day
Global Stock: ship in 5-7 days

Inquiry

Quality Control of [ 107998-45-8 ] SDS Specification MoL

COA NMR CNMR HPLC LC-MS
Chemical & Physical Properties
CAS Number107998-45-8
Catalog No.2A-4201006
Molecular FormulaC7H15NO2
Molecular Weight145.20
PubChem ID43651721
InChIInChI=1S/C7H15NO2/c1-4-5(2)6(8)7(9)10-3/h5-6H,4,8H2,1-3H3/t5-,6-/m1/s1
InChI KeyYXMMTUJDQTVJEN-PHDIDXHHSA-N
Related Products in Coating Raw Materials
Waterborne polyurethane resin WPU-835N2A-21986702A-2198670
Latent curing agent specifically designed for one-component epoxy resin curing systems2A-02009522A-0200952
A flexible epoxy resin,low total chlorine content, low viscosity2A-02009532A-0200953
A liquid curing agent suitable for epoxy resin curing systems2A-02009552A-0200955
A latent epoxy resin curing accelerator primarily used in epoxy- anhydride systems2A-02009562A-0200956
Toluene diisocyanate tdi 80/202A-42019162A-4201916
Browse all Coating Raw Materials products »
Contact Us

Phone:

630-322-8886

630-322-8887

Email:

[email protected]

Office Locations:

Chicago, IL, USA

San Francisco, CA, USA