Resin epoxy structure, CAS 24969-06-0

Resin epoxy

CAS Number24969-06-0

Synonymsepoxy resin; MFCD00084412; EINECS 500-033-5; Oxirane,2-(chloromethyl)-, homopolymer; Resin epoxy

Molecular Formula[CH(CH2Cl)CH2O]n

Molecular Weight99999.99999

Purity

Density1.315 g/mL at 25 °C(lit.)

Boiling Point

Melting Point115-120 °C

Flash Point

Appearanceliquid

EINECS

MSDSChineseEnglish

Symbol

Signal Word

Cat. No.: 2A-1193207 Purity:
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Quality Control of [ 24969-06-0 ] SDS Specification MoL

Chemical & Physical Properties
CAS Number24969-06-0
Catalog No.2A-1193207
Chinese Name聚环氧氯丙烷
Synonymsepoxy resin; MFCD00084412; EINECS 500-033-5; Oxirane,2-(chloromethyl)-, homopolymer; Resin epoxy
Molecular Formula[CH(CH2Cl)CH2O]n
Molecular Weight99999.99999
Density1.315 g/mL at 25 °C(lit.)
Melting Point115-120 °C
Appearanceliquid
Storage ConditionStorage precautions: Store in a cool, ventilated w
SMILESOC=CCCl
InChI KeyNUFHKADPPUOUFS-IWQZZHSRSA-N
NACRES CodeNA.25
UNSPSC12352106
Transport InfoProduct Name: Polyepichlorohydrin
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