
CAS Number7440-50-8
SynonymsMFCD00239961; Cu(II); m3s; cda122; cda110; m3r; copper(2+) ion; cda102; cda101; copper(II) cation; Cu++; Copper (II); Copper(2+); COPPER (II) ION; EINECS 231-159-6; cum3; ce1110; copper(II); Cu+2; Copper
Molecular FormulaCu
Molecular Weight63.55
Purity98.00%
Density8.92
Boiling Point2567 °C (lit.)
Melting Point1083.4 °C (lit.)
Appearancenanopowder
EINECS231-159-6
Symbol
Signal WordWarning
| Chemical & Physical Properties | |
|---|---|
| CAS Number | 7440-50-8 |
| Catalog No. | 2A-9014160 |
| Chinese Name | 铜粉 |
| Synonyms | MFCD00239961; Cu(II); m3s; cda122; cda110; m3r; copper(2+) ion; cda102; cda101; copper(II) cation; Cu++; Copper (II); Copper(2+); COPPER (II) ION; EINECS 231-159-6; cum3; ce1110; copper(II); Cu+2; Copper |
| Molecular Formula | Cu |
| Molecular Weight | 63.55 |
| Purity | 98.00 |
| Density | 8.92 |
| Boiling Point | 2567 °C (lit.) |
| Melting Point | 1083.4 °C (lit.) |
| Appearance | nanopowder |
| Water Solubility | insoluble |
| Storage Condition | Store in a cool, ventilated warehouse. Keep away f |
| Packaging | III |
| EINECS | 231-159-6 |
| HTC | 7402000090 |
| PubChem ID | 329767661 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| InChI | 1S/Cu |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| NACRES Code | NA.23 |
| UNSPSC | 41141805 |
| Hazard Symbols | 4.1 |
| MSDS | msds/14160_1_7440_50_8.pdf |
| Transport Info | Product name: Atomized copper powder |
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